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博思數(shù)據(jù)研究中心

Global and China Advanced Packaging Industry Report, 2009-2010

2010-09-25                  來源:博思數(shù)據(jù)研究中心              
字體大小:
導讀: 【Table of Contents】 1 Status Quo and Future of IC Advanced Packaging 1.1 Profile of IC Packaging 1.2 Types of IC Packaging 1.2.1 SOP 1.2.

of Camel Precision Co.,
Ltd., 2008Q1-2009Q2
Revenue Structure of Camel Precision Co., Ltd. by Region,
2007Q1-2009Q2
Revenue and Operating Margin of IBIDEN, FY2004-FY2010
Revenue and Operating Margin of IBIDEN, FY2009Q1-FY2010Q4
Revenue of IBIDEN by Region, FY2004-FY2009
Revenue and Operating Margin of Shinko Electric Industries Co.,
Ltd., FY2005-FY2011
Assets of Shinko Electric Industries Co., Ltd., FY2005-FY2009
Capital Expenditure of Shinko Electric Industries Co., Ltd.,
FY2005-FY2009
Revenue of Shinko Electric Industries Co., Ltd. by Product,
FY2005-FY2011
Revenue and Operating Margin of Nepes, 2003-2010
Revenue of Nepes by Product, 2007-2010
Revenue and EBITDA Margin of STS Semiconductor, 2004-2010
Revenue of STS Semiconductor by Product, 2008-2010
Revenue and Operating Margin of Samsung Electro-Mechanics BGA
Packaging Business, 2005Q1-2010Q4
Revenue and Operating Margin of Samsung Electro-Mechanics FC-BGA
Packaging Business, 2005Q1-2010Q4
ACI Sector Revenue of Samsung Electro-Mechanics, 2010Q1&Q2
Revenue of Samsung Electro-Mechanics Packaging by Application,
2010Q1&Q2
Revenue and Operating Margin of JCET, 2005-2010
Revenue

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