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博思數(shù)據(jù)研究中心

Global and China Advanced Packaging Industry Report, 2009-2010

2010-09-25                  來源:博思數(shù)據(jù)研究中心              
字體大。
導(dǎo)讀: 【Table of Contents】 1 Status Quo and Future of IC Advanced Packaging 1.1 Profile of IC Packaging 1.2 Types of IC Packaging 1.2.1 SOP 1.2.


Revenue of KYEC by Product, 2005-2010
KYEC Revenue by Application, 2005-2010
Revenue, Gross Margin and Operating Margin of Amkor, 2005-2010
Sales, Administration Management and R&D Expenditures of Amkor,
2007-2010Q2
Capital Expenditure of Amkor, 2007-2010Q2
Revenue of Amkor by Packaging Technology, 2007-2009
Revenue of Amkor by Packaging Technology, 2008Q4-2010Q2
Shipment of Amkor by Packaging Technology, 2008Q4-2010Q2
Revenue and Shipment of Amkor CSP Packaging Business, 2005-2010Q2
Revenue and Shipment of Amkor CSP Packaging Business, 2008Q1-2010Q2 

Revenue of Amkor CSP Packaging by Application, 2010Q2
Revenue and Shipment of Amkor BGA Packaging Business, 2005-2010Q2
Revenue and Shipment of Amkor BGA Packaging Business, 2008Q1-2010Q2
Revenue of Amkor BGA Packaging by Application, 2010Q2
Revenue and Shipment of Amkor Leadframe Packaging Business,
2005-2010Q2
Revenue and Shipment of Amkor Leadframe Packaging Business,
2008Q1-2010Q2
Revenue of Amkor Leadframe Packaging by Application, 2010Q2
Revenue and Shipment of Amkor Test Business, 2005-2010Q2
Revenue and Shipment of Amkor Test Business, 2008Q1-2010Q2
Revenue of Amkor Test Business

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