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博思數(shù)據(jù)研究中心

Global and China Advanced Packaging Industry Report, 2009-2010

2010-09-25                  來源:博思數(shù)據(jù)研究中心              
字體大。
導讀: 【Table of Contents】 1 Status Quo and Future of IC Advanced Packaging 1.1 Profile of IC Packaging 1.2 Types of IC Packaging 1.2.1 SOP 1.2.

by Application, 2010Q2
Capacity Utilization Rate of Amkor, 2008Q1-2010Q2
AMKOR Revenue by Application, 2008Q1-2010Q2
Output Value of Amkor by Region, 2010Q1
Output of Amkor by Region, 2010Q2
SPIL Organizational Structure
Revenue, Gross Margin and Operating Margin of SPIL, 2003-2010
Capital Expenditure of SPIL, 2001-2010
Revenue of SPIL by Region, 2009-2010Q1&Q2
Revenue of SPIL by Application, 2009-2010Q1&Q2
Revenue of SPIL by Package Type, 2009-2010Q1&Q2
Revenue Proportion of SPIL Copper Wire Bonding, Jan.-Jun.2010
Revenue and Gross Margin of STATS ChipPAC Ltd., 2004-2010
Revenue of STATS ChipPAC Ltd. by Package Type, 2006-2010
Revenue of STATS ChipPAC Ltd. by Application, 2006-2010
Downstream Regional Distribution of STATS ChipPAC Ltd. Revenue,
2006-2010
Organizational Structure of ASE Inc.
Revenue and Gross Margin of ASE Inc., 2001-2010
Revenue, Gross Margin, and Operating Margin of ASE Inc.,
2009Q1-2010Q2
Revenue, Gross Margin, and Operating Margin of ASE Inc. Packaging
Business, 2009Q1-2010Q2
Revenue of ASE Inc. Packaging Business by Technology, 2009Q1-2010Q2
Revenue, Gross Margin, and Operating Margin of ASE Inc. Test
Business,

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